Siemens and TSMC deliver new certifications and design solutions for the foundry’s most advanced process technologies.

Many industry trends are driving chip developers to consider multi-die designs using advanced 2.5D and 3D technologies. Such designs enable incorporating heterogeneous and homogeneous dies in a single ...

Day by day, technology continues to shrink while the transistor counts on chip increases, leading to greater design complexity. As a result, Metal ECO plays an important role in addressing last-minute ...

Achieving design closure in a system-on-a-chip (SoC) development project generally requires a great deal of patience. SoCs tend to include more and more custom circuitry, which means long simulation ...